A Study on Integration of Acetone Charged Copper Pipes (ACCP) to MR16 Indoor Lighting Solutions

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Gopalakrishna K.
Krishna Venkatesh
Rama Narasimha K.
Ananda M. A.
Parasuram A. K.
Gururaja G.
Jayaprakash P. N.
Sendil Kumar T. J.

Abstract

The aim of the present study is to improve the thermal performance of the MR16, 7 W and 9 W LED decorative lighting solutions by integration of acetone charged copper pipe (ACCP) into its aluminum heat sink. With integration of ACCP, the luminary designed for lower wattage can withstand higher wattage and can accommodate more LED’s with increased illumination. The heat transfer characteristics of high power LED is analyzed and a novel ACCP cooling device for high power LED is designed. The thermal capabilities of lighting solutions with integration of ACCP and without integration of ACCP for the same load (fixture + heat sink) were investigated experimentally. The experimental results indicate that the given load can accommodate more LED’s for higher wattage which can be attributed to improved heat transfer after integration of ACCPs resulting in increased illumination.

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How to Cite
K., G., Venkatesh, K., K., R. N., M. A., A., A. K., P., G., G., P. N., J., & T. J., S. K. (2013). A Study on Integration of Acetone Charged Copper Pipes (ACCP) to MR16 Indoor Lighting Solutions. Power Research - A Journal of CPRI, 9(1), 163–168. Retrieved from https://node6473.myfcloud.com/~geosocin/CPRI/index.php/pr/article/view/579

References

  1. Gao S, Hong J, Shin S, Lee Y, Choi S and Yi S. “Design optimization on the heat transfer and mechanical reliability of high brightness light emitting diodes (HBLED) package”, 58th Electronic Components and Technology Conf., Orlando, pp. 798–803, 2008.
  2. Weng C J. “Advanced thermal enhancement and management of LED packages”, Int. Commun. Heat Mass Transfer, Vol. 36, pp. 245–248, 2009.
  3. Cheng T, Luo X, Huang S and Liu S. “Thermal analysis and optimization of multiple LED packaging based on a general analytical solution”, Int. J. Therm. Sci., Vol. 49, pp. 196–201, 2010.
  4. Christensen A, Graham S. “Thermal effects in packaging high power light emitting diode arrays”, Appl. Therm. Eng., Vol. 29, pp. 364–371, 2009.
  5. Chuang S L, Ishibashi A, Kijima S, Nakayama N, Ukita M and Taniguchi S. “Kinetic model for degradation of light emitting diodes”, IEEE J. Quantum Electron. Vol. 33, pp. 970–979, 1997.
  6. Luo X B, Xiong W, Cheng T and Liu S. Temperature estimation of high-power light emitting diode street lamp by a multi-chip analytical solution, IET Optoelectron. Vol. 3 No. 5, pp. 225–232, 2009.
  7. Christensen A, Ha M and Graham S. “Thermal management methods for compact high power LED arrays”, 7th International Conference on Solid State Lighting, San Diego, 66690Z.1 66690Z, pp. 19, 2007.
  8. Kim L, Choi J H, Jang S H and Shin M W. “Thermal analysis of LED array system with Heat Pipe”, 6th Symposium of the Korean Society of Thermo-physical Properties, Seoul, pp. 21–25, 2006.
  9. Kim L, Choi J H, Jang S H, Shin M W, Thermochim, Acta 455, pp. 21–25, 2007.
  10. Sheu G J, Hwu F S, Tu S H, Chen W T, Chang J Y, Chen J C, Proc. SPIE 5941, pp. 13–20, 2005.